Polyimide film poessesses a unique combination of properties which make it ideal for a viariety of application in many different industries. Polyimide film is synthesized by polymerizing an aromatic dianhydride and an aromatic diamine. It has excellent chemical resisitance, execellent physical,electrical and mechanical propertities at low and high temperature.

Polyimide film does not melt or burn for it's highest UL-94 flammability rating; V-0; the outstanding properties permit it to be used in both extremes high and low temperature where other organic polymeric materials would be in functional.

Polyimide film can be used in a variety of electrical and electronic insulation applications; wire and cable tapes, formed coil insulation,substrate for flexible printed circuits,motor slot liners,magnet wire insulation,transformer and capacitor insulation,magnetic and pessure sensitive tapes,semiconductor insulator,insulator pads,semeconductor radiation protection,solder masks,fiber-optic cable protection,carriere film for tape automated bonding,bar code labels,voice coils,high-temperature diaphragms,pressure switches,gaskets diaghragms,sensors,etc.